Reply To: Effect of Cu addition on properties of Ti-Al-Si-N nanocomposite films deposited by cathodic vacuum arc ion plating
DOI: 10.1016/j.surfcoat.2011.12.027Author: J. Shi et al.Published: 2012-2

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DOI: 10.1016/j.surfcoat.2011.12.027Author: J. Shi et al.Published: 2012-2
› Reply To: Effect of Cu addition on properties of Ti-Al-Si-N nanocomposite films deposited by cathodic vacuum arc ion plating
DOI: 10.1016/j.surfcoat.2011.12.027Author: J. Shi et al.Published: 2012-2

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Title: Effect of Cu addition on properties of Ti-Al-Si-N nanocomposite films deposited by cathodic vacuum arc ion plating
Journal: Surface and Coatings Technology
Source url: https://doi.org/10.1016/j.surfcoat.2011.12.027