Evaluation of die edge cracking in flip-chip PBGA packages
DOI: 10.1109/tcapt.2003.821677Author: L.L. Mercado et al.Published: 2003-12

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DOI: 10.1109/tcapt.2003.821677Author: L.L. Mercado et al.Published: 2003-12

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  • May 3, 2026 at 8:53 pm #1484
    gordonGordon
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    Title: Evaluation of die edge cracking in flip-chip PBGA packages
    Journal: IEEE Transactions on Components and Packaging Technologies
    Authors: L.L. Mercado, V. Sarihan
    Date: 2003-12
    DOI: 10.1109/tcapt.2003.821677
    Source: Institute of Electrical and Electronics Engineers (IEEE)
    Source URL: https://doi.org/10.1109/tcapt.2003.821677

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