Study of Different Dispensing Patterns of No-Flow Underfill Using

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Journal: Journal of Electronic Packaging

Authors: Muhammad Naqib Nashrudin, Aizat Abas, M. Z. Abdullah, M. Yusuf Tura Ali, Z. Samsudin

Published date: 2021-9-1

DOI: 10.1115/1.4049175

PDF link: http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4049175/6622982/ep_143_03_031005.pdf

Article link: https://doi.org/10.1115/1.4049175

Article Source: ASME International

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Title: Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods
Journal: Journal of Electronic Packaging
Source url: https://doi.org/10.1115/1.4049175

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